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Integrated circuit, hybrid, and multichip module package design guidelines : a focus on reliability / Michael Pecht. [Contributors: Ajay Arora ...]
Contributor(s): Resource type: Ressourcentyp: BuchBookLanguage: English Publisher: New York [u.a.] : Wiley, 1994Edition: 2. [print.]Description: XXXI, 426 SISBN:- 0471594466
- 621.381046
- 621.381/046
- 2
| Item type | Home library | Collection | Shelving location | Call number | Status | Barcode | |
|---|---|---|---|---|---|---|---|
| Freihandbestand ausleihbar | Bibliothek Campus Süd | nach 8.25 | Lesesaal Technik (LST) | 94 A 1645 | Available | 44418248090 |
Total holds: 0
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