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Nanopackaging : nanotechnologies and electronics packaging / James E. Morris, ed.

By: Resource type: Ressourcentyp: Buch (Online)Book (Online)Language: English Publisher: Boston, MA : Springer-Verlag US, 2008Description: Online-Ressource (XXI, 543 p, digital)ISBN:
  • 9780387473260
Subject(s): Genre/Form: Additional physical formats: 9780387473253 | Buchausg. u.d.T.: Nanopackaging. New York, NY : Springer, 2008. XXI, 543 S.DDC classification:
  • 620.115
  • 621.381046
RVK: RVK: ZN 3700 | ZN 4192LOC classification:
  • T174.7 TA418.9.N35
DOI: DOI: 10.1007/978-0-387-47325-3Online resources: Summary: Nanotechnologies are being applied to microelectronics packaging, primarily in the applications of nanoparticle nanocomposites, or in the exploitation of the superior mechanical, electrical, or thermal properties of carbon nanotubes. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive ““inks,”” underfill fillers, and solder enhancement. ““Nanopackaging”” is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of their field, and others with interests in nanotechnology. It will survey the application of nanotechnologies to electronics packaging, as represented by current research across the field.PPN: PPN: 1647883644Package identifier: Produktsigel: ZDB-1-SCM | ZDB-2-CMS
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