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Foundations for microstrip circuit design / T. C. Edwards

By: Contributor(s): Resource type: Ressourcentyp: Buch (Online)Book (Online)Language: English Series: Wiley - IEEE SerPublisher: Chichester, West Sussex, United Kingdom : IEEE Press, 2016Edition: Fourth editionDescription: 1 online resourceISBN:
  • 9781118936184
Subject(s): Additional physical formats: 9781118936191 | 9781118936160 | Erscheint auch als: Foundations for microstrip circuit design. Online-Ausgabe. Fourth edition. Chichester, West Sussex, United Kingdom : John Wiley & Sons Inc, 2016. Online RessourceLOC classification:
  • TK7876
Online resources: Summary: Intro -- Title Page -- Copyright -- List of Trademarks -- Dedication -- Table of Contents -- Preface -- Acknowledgements -- Chapter 1: Introduction to Design Using Microstrip and Planar Lines -- 1.1 Introduction -- 1.2 Origins of Microstrip -- 1.3 RF and Microwave Modules -- 1.4 Interconnections on RF and Microwave Integrated Circuits -- 1.5 High-speed Digital Interconnections -- 1.6 Summary -- References -- Chapter 2: Fundamentals of Signal Transmission on Interconnects -- 2.1 Introduction -- 2.2 Transmission Lines and Interconnects -- 2.3 Interconnects as Part of a Packaging Hierarchy -- 2.4 The Physical Basis of Interconnects -- 2.5 The Physics, a Guided Wave -- 2.6 When an Interconnect Should be Treated as a Transmission Line -- 2.7 The Concept of RF Transmission Lines -- 2.8 Primary Transmission Line Constants -- 2.9 Secondary Constants for Transmission Lines -- 2.10 Transmission Line Impedances -- 2.11 Reflection -- 2.12 Multiple Conductors -- 2.13 Return Currents -- 2.14 Modeling of Interconnects -- 2.15 Summary -- References -- Chapter 3: Microwave Network Analysis -- 3.1 Introduction -- 3.2 Two-port Networks -- 3.3 Scattering Parameter Theory -- 3.4 Signal-flow Graph Techniques and S Parameters -- 3.5 Summary -- References -- Chapter 4: Transmission Line Theory -- 4.1 Introduction -- 4.2 Transmission Line Theory -- 4.3 Chain (ABCD) Parameters for a Uniform Length of Loss-free Transmission Line -- 4.4 Change in Reference Plane -- 4.5 Working With a Complex Characteristic Impedance -- 4.6 Summary -- References -- Chapter 5: Planar Interconnect Technologies -- 5.1 Introductory Remarks -- 5.2 Microwave Frequencies and Applications -- 5.3 Transmission Line Structures -- 5.4 Substrates for Planar Transmission Lines -- 5.5 Thin-film Modules -- 5.6 Thick-film Modules -- 5.7 Monolithic Technology -- 5.8 Printed Circuit Boards.PPN: PPN: 1657550508Package identifier: Produktsigel: ZDB-26-MYL | ZDB-30-PAD | ZDB-30-PQE | BSZ-30-PQE-K1DLR
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