RF and Microwave Microelectronics Packaging II / edited by Ken Kuang, Rick Sturdivant

Contributor(s):

Resource type: Ressourcentyp: Buch (Online)Book (Online)Language: English Series: SpringerLink BücherPublisher: Cham ; s.l. : Springer International Publishing, 2017Description: Online-Ressource (XII, 172 p. 127 illus., 77 illus. in color, online resource)ISBN:

9783319516974

Subject(s):

Additional physical formats: 9783319516967 | Druckausg.: 978-3-319-51696-7 LOC classification:

TK7800-8360 TK7874-7874.9
TK7800-8360
TK7874-7874.9

DOI: DOI: 10.1007/978-3-319-51697-4Online resources:

Summary: Reviews RF, microwave, and microelectronics assembly process, quality control, and failure analysis Bridges the gap between low cost commercial and hi-res RF/Microwave packaging technologies Engages in an in-depth discussion of challenges in packaging and assembly of advanced high-power amplifiers This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronicsSummary: Chapter1. Introduction to RF and Microwave Microelectronic Packaging -- Chapter2. Packaging of Transmit/Receive Modules -- Chapter3. 3D Transitions and Connections -- Chapter4. Electromagnetic Shielding for RF & Microwave Packages -- Chapter5. Design of C-Band Interdigital Filter and Compact C-band Hairpin Bandpass Film Filter on Thin Film Substrate -- Chapter6. Research on High-reliable Low-loss HTCC Technology Applied in Millimeter Wave SMT Package -- Chapter7. Chip Size Packaging (CSP) for RF MEMS Devices -- Chapter8. The challenge in packaging and assembly the advanced power amplifiers -- Chapter9. High Thermal Conductivity Materials - Aluminum Diamond, Aluminum Silicon Carbide, and Copper Diamond -- Chapter10. Advancement in High Thermal Conductive Graphite for Microelectronic Packaging -- Chapter11. Carbon nanotubes and graphene for microwave/RF electronics packagingPPN: PPN: 1657600815Package identifier: Produktsigel: ZDB-2-ENG

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