Electrical Design of Through Silicon Via / edited by Manho Lee, Jun So Pak, Joungho Kim

By:

Lee, Manho [aut]

Contributor(s):

Resource type: Ressourcentyp: Buch (Online)Book (Online)Language: English Series: SpringerLink BücherPublisher: Dordrecht ; s.l. : Springer Netherlands, 2014Description: Online-Ressource (IX, 280 p. 249 illus, online resource)ISBN:

9789401790383

Subject(s):

Additional physical formats: 9789401790376 | Druckausg.: 978-940-179-037-6 LOC classification:

TK7888.4

DOI: DOI: 10.1007/978-94-017-9038-3Online resources:

Contents:

Summary: Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity, and even thermal integrity. Most of the analysis in this book include simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have been studied deep into a TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively coveredPPN: PPN: 1657883671Package identifier: Produktsigel: ZDB-2-ENG

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