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Tenth International Conference on Thin Film Physics and Applications (TFPA 2019) : 19-22 May 2019, Qingdao, China / Jianda Shao, Takahisa Jitsuno, Wolfgang Rudolph (editors) ; sponsored by: SPIE, SIOM - Shanghai Institute of Optics and Fine Mechanics (China)

By: Contributor(s): Resource type: Ressourcentyp: Buch (Online)Book (Online)Language: English Series: SPIE. Proceedings of SPIE ; volume 11064Publisher: Bellingham, Washington, USA : SPIE, [2019]Description: 1 Online-Ressource : IllustrationenISBN:
  • 9781510628199
Other title:
  • 10th
Subject(s): Genre/Form: Additional physical formats: 9781510628182 Online resources: PPN: PPN: 1682242994Package identifier: Produktsigel: ZDB-1-SPIE
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