Tenth International Conference on Thin Film Physics and Applications (TFPA 2019) : 19-22 May 2019, Qingdao, China / Jianda Shao, Takahisa Jitsuno, Wolfgang Rudolph (editors) ; sponsored by: SPIE, SIOM - Shanghai Institute of Optics and Fine Mechanics (China)
Contributor(s): Resource type: Ressourcentyp: Buch (Online)Book (Online)Language: English Series: SPIE. Proceedings of SPIE ; volume 11064Publisher: Bellingham, Washington, USA : SPIE, [2019]Description: 1 Online-Ressource : IllustrationenISBN:- 9781510628199
- 10th
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