Guide to semiconductor engineering / Jerzy Ruzyllo, Penn State University, USA

By:

Ruzyllo, Jerzy [VerfasserIn]

Resource type: Ressourcentyp: Buch (Online)Book (Online)Language: English Publisher: Singapore ; Hackensack, NJ : World Scientific Publishing Co. Pte. Ltd, [2020]Copyright date: © 2020Description: 1 Online-Ressource (xiii, 283 Seiten) : IllustrationenISBN:

9789811216008
9789811216015

Subject(s):

Additional physical formats: 9789811215995. | 9789811218736. DDC classification:

621.3815/2
621.3815/209

LOC classification:

TK7871.85

DOI: DOI: 10.1142/11706Online resources:

Zugang im Netz des KIT

Summary: Intro -- Contents -- Preface -- 1. Semiconductor Properties -- Chapter Overview -- 1.1 Electrical Conductivity of Solids -- 1.1.1 Interatomic bonds and electrical conductivity -- 1.1.2 Energy band structure and electrical conductivity -- 1.2 Electric Charge Carriers -- 1.2.1 Electrons and holes as carriers of electric charge -- 1.2.2 Generation and recombination processes -- 1.2.3 Charge carriers in motion -- 1.3 Semiconductors and External Inuences -- 1.3.1 Semiconductor and electric and magnetic fields -- 1.3.2 Semiconductors and light -- 1.3.3 Semiconductors and temperatureSummary: 1.4 Semiconductors in Nanoscale -- Key Terms -- 2. Semiconductor Materials -- Chapter Overview -- 2.1 Crystal Structure of Solids -- 2.1.1 Crystal lattice -- 2.1.2 Structural defects -- 2.2 Elements of Semiconductor Material System -- 2.2.1 Surfaces and interfaces -- 2.2.2 Thin-films -- 2.3 Inorganic Semiconductors -- 2.3.1 Elemental semiconductors -- 2.3.2 Compound semiconductors -- 2.3.3 Nanoscale inorganic semiconductors -- 2.4 Materials Selection Criteria -- 2.5 Organic Semiconductors -- 2.6 Bulk Single-Crystal Formation -- 2.6.1 CZ single-crystal growth -- 2.6.2 Alternative methodsSummary: 2.7 Thin-Film Single Crystal Formation -- 2.7.1 Epitaxial deposition -- 2.7.2 Lattice matched and lattice mismatched epitaxial deposition -- 2.8 Substrates -- 2.8.1 Semiconductor substrates -- 2.8.2 Non-semiconductor substrates -- 2.9 Thin-Film Insulators -- 2.9.1 General characteristics -- 2.9.2 Multi-purpose thin-film insulators -- 2.9.3 Dedicated thin-film insulators -- 2.10 Thin-Film Conductors -- 2.10.1 Metals -- 2.10.2 Metal alloys -- 2.10.3 Non-metallic conductors -- Key Terms -- 3. Semiconductor Devices and How They Are Used -- Chapter Overview -- 3.1 Semiconductor DevicesSummary: 3.2 Constructing Semiconductor Device -- 3.2.1 Ohmic contacts -- 3.2.2 Potential barrier -- 3.3 Two-Terminal Devices: Diodes -- 3.3.1 Diodes -- 3.3.2 Metal-Oxide-Semiconductor (MOS) Capacitors -- 3.4 Three Terminal Devices: Transistors -- 3.4.1 Transistor action -- 3.4.2 Types of transistors -- 3.4.3 Operation of the MOSFET -- 3.4.4 Complementary MOS, CMOS -- 3.4.5 Evolution of the MOSFET -- 3.4.6 Thin-Film Transistor (TFT) -- 3.5 Integrated Circuits -- 3.6 Image Displaying and Image Sensing Devices -- 3.7 Micro-Electro-Mechanical Systems (MEMS) and Sensors -- 3.7.1 MEMS/NEMS devicesSummary: 3.7.2 Sensors -- 3.8 Wearable and Implantable Semiconductor Device Systems -- Key Terms -- 4. Process Technology -- Chapter Overview -- 4.1 Substrates from the Process Perspective -- 4.1.1 Wafer substrates -- 4.1.2 Large area substrates -- 4.1.3 Flexible substrates -- 4.1.4 Substrates in further discussion -- 4.2 Liquid-Phase (Wet) Processes -- 4.2.1 Water -- 4.2.2 Specialty chemicals -- 4.2.3 Wafer drying -- 4.3 Gas-Phase (Dry) Processes -- 4.3.1 Gases -- 4.3.2 Vacuum -- 4.4 Processes in Semiconductor Manufacturing -- 4.4.1 Thermal processes -- 4.4.2 Plasma processesPPN: PPN: 1733602348Package identifier: Produktsigel: ZDB-124-WOP | ZDB-124-WSE

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