Thermal Design of Liquid Cooled Microelectronic Equipment : Thermal Solutions, Analysis Methods, and Desing Practices / Lian-Tuu Yeh

By: Contributor(s): Resource type: Ressourcentyp: Buch (Online)Book (Online)Publisher number: 861936Language: English Publisher: New York, N.Y : The American Society of Mechanical Engineers, [2019]Description: 1 Online-Ressource (350 pages) : illustrationsSubject(s): Additional physical formats: 9780791861936. | 0791861937. | Erscheint auch als: Thermal Design of Liquid Cooled Microelectronic Equipment : Thermal Solutions, Analysis Methods, and Desing Practices. Druck-Ausgabe. New York, N.Y : The American Society of Mechanical Engineers, 2019DDC classification:
  • 621.381
LOC classification:
  • TK7870.25
DOI: DOI: 10.1115/1.861936Online resources: Additional physical formats: Also available in print and PDF edition.Additional physical formats: Full text article also available for purchase.Additional physical formats: Electronic reproduction; Mode of access: World Wide WebSummary: Front Matter -- 1. Introduction -- 2. Fundamentals of Convective and Boiling Heat Transfer -- 3. Key Components of Liquid Cooled Systems -- 4. Heat Transfer from Components to Coolant -- 5. Liquid Cooling Technologies -- 6. Two-Phase Heat Transfer Devices -- 7. Liquid Cooled Microelectronic Equipment -- 8. Thermal Design Guide of Liquid Cooled Systems -- Back Matter.Summary: This book places a great deal of emphasis on providing practical solutions to thermal issues related to high power systems where liquid cooling is required. The book serves as a general thermal design guide for any liquid cooled systems with the main focus on microelectronic equipment that includes digital and/or analog devices. This book provides a comprehensive review and overview of all liquid cooling technologies as well as their applications to commercial products in industry. To facilitate design and analysis, the most commonly used correlations for the friction factor and heat transfer coefficient with either single phase liquid or two phase flow are summarized in the book. The general guidelines for thermal design of liquid cooled systems along with a step-by-step thermal analysis and design procedure are presented for liquid cooled systems with or without boiling. To meet the needs in telecommunication industry in which no liquid cooled rack is currently available commercially, a detailed system thermal design of liquid cooled telecommunication equipment is made, and two thermal design options based on open loop and closed loop cooling schemes, respectively are presented. Furthermore, the cooling solutions and design procedures discussed here can readily and easily be applied to any systems in other industriesPPN: PPN: 1736708376Package identifier: Produktsigel: ZDB-240-ASM
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New York, N.Y : The American Society of Mechanical Engineers, 2019. Electronic reproduction; Mode of access: World Wide Web. Full text article also available for purchase. Also available in print and PDF edition |2019||||||||||

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