Semiconductor Advanced Packaging / by John H. Lau

By:

Lau, John H [VerfasserIn]

Resource type: Ressourcentyp: Buch (Online)Book (Online)Language: English Publisher: Singapore : Springer Singapore, 2021Publisher: Singapore : Imprint: Springer, 2021Edition: 1st ed. 2021Description: 1 Online-Ressource(XXII, 498 p. 557 illus., 530 illus. in color.)ISBN:

9789811613760

Subject(s):

621.381 23

DOI: DOI: 10.1007/978-981-16-1376-0Online resources:

Summary: Recent Advance on Semiconductor Packaging -- System-in-Package -- Fan-In Wafer/Panel-Level Chip-Scale Packages -- Fan-Out Wafer/Panel-Level Packaging -- 2D, 2.1D, and 2.3D IC Integration -- 2.5D IC Integration -- 3D IC Integration -- Hybrid Bonding -- Chiplets Packaging -- Dielectric Materials -- Trends and Roadmap for Advanced Semiconductor Packaging.Summary: The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.PPN: PPN: 1759334529Package identifier: Produktsigel: ZDB-2-ENG | ZDB-2-SEB | ZDB-2-SXE

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