Custom cover image
Custom cover image

AI Methods and Applications in 3D Technologies : Proceedings of 3DWCAI 2023 / edited by Roumen Kountchev (Deceased), Srikanta Patnaik, Wenfeng Wang, Roumiana Kountcheva

Contributor(s): Resource type: Ressourcentyp: Buch (Online)Book (Online)Language: English Series: Smart Innovation, Systems and Technologies ; 388Publisher: Singapore : Springer Nature Singapore, 2024Publisher: Singapore : Imprint: Springer, 2024Edition: 1st ed. 2024Description: 1 Online-Ressource(IX, 406 p. 194 illus., 151 illus. in color.)ISBN:
  • 9789819721443
Subject(s): Additional physical formats: 9789819721436 | 9789819721450 | 9789819767519 | Erscheint auch als: 9789819721436 Druck-Ausgabe | Erscheint auch als: 9789819721450 Druck-Ausgabe | Erscheint auch als: 9789819767519 Druck-AusgabeDOI: DOI: 10.1007/978-981-97-2144-3Online resources: Summary: This book features a collection of high-quality, peer-reviewed research papers presented at Second 'World Conference on Intelligent and 3D Technologies' (WCI3DT 2023), held in China during 26–28 May 2023. The book provides an opportunity to researchers and academia as well as practitioners from industry to publish their ideas and recent research development work on all aspects of 3D imaging technologies and artificial intelligence, their applications, and other related areas. The book presents ideas and the works of scientists, engineers, educators, and students from all over the world from institutions and industries.PPN: PPN: 1900995239Package identifier: Produktsigel: ZDB-2-SEB | ZDB-2-INR | ZDB-2-SXIT
No physical items for this record
KIT – The Research University in the Helmholtz Association                         Home | Impressum | Datenschutz | Barrierefreiheit | KIT