Semiconductor packaging : materials interaction and reliability / Andrea Chen, Randy Hsiao-Yu Lo

Von:

Chen, Andrea [VerfasserIn]

Mitwirkende(r):

Lo, Randy [MitwirkendeR]

Resource type: Ressourcentyp: Buch (Online)Buch (Online)Sprache: Englisch Verlag: Boca Raton, Fla. : CRC Press, 2012Beschreibung: 1 online resource (xviii, 198 pages) : illustrationsISBN:

9781439862070
1439862079
9781283274609
1283274604

Schlagwörter:

Andere physische Formen: 9781439862056. | 1439862052. | 9781138075405 | Erscheint auch als: 9781439862056 Druck-AusgabeDDC-Klassifikation:

621.38152

DOI: DOI: 10.1201/b11260Online-Ressourcen:

Zugang im Netz des KIT

Zusammenfassung: Section 1. Semiconductor packages -- section 2. Package reliability -- section 3. Materials used in semiconductor packaging -- section 4. The future.Zusammenfassung: In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.PPN: PPN: 1780091907Package identifier: Produktsigel: BSZ-7-TFC-GIGA | ZDB-7-TFC | ZDB-7-TOA

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