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Wire bonding in microelectronics / George Harman

By: Resource type: Ressourcentyp: BuchBookLanguage: English Publisher: New York, NY [u.a.] : McGraw-Hill, 2010Edition: 3. ed. [fully updated]Description: XX, 426 S : Ill., graph. Darst + 1 CD-ROM (12 cm)ISBN:
  • 007170101X
  • 9780071701013
  • 0071476237
  • 0071703349
  • 9780071476232
  • 9780071703345
Other title:
  • Wire bonding
Subject(s): Additional physical formats: 9780071642651. | Online-Ausg.: Wire bonding in microelectronics. 3rd ed (Online-Ausg.). New York : McGraw-Hill, 2010. Online-Ressource (1 online resource (xx, 426 p.))DDC classification:
  • 621.381
RVK: RVK: ZN 4900 | ZN 4192LOC classification:
  • TK7836
Call number: Grundsignatur: 2011 A 7199(3)PPN: PPN: 582050286
Holdings
Item type Home library Collection Shelving location Call number Status Date due Barcode
Handbibliothek IMT nach 8.23 Handbibliothek (Ausleihe und Einsicht nicht möglich) 2011 A 7199(3) Checked out Ausleihe und Einsicht nicht möglich 06.08.2035 51759945090
Total holds: 0
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