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IEEE transactions on components, packaging and manufacturing technology

By:

Institute of Electrical and Electronics Engineers [VerfasserIn]

Resource type: Ressourcentyp: Zeitschrift (Online)Periodical (Online)Language: English Volumes: Bände: Show volumesZeige BändePublisher: New York, NY : IEEE, 2011-Description: Online-RessourceISSN:

2156-3985

Other title:

Nebent: Components, packaging and manufacturing technology

Genre/Form:

Zeitschrift

Additional physical formats: 2156-3950 | Erscheint auch als: IEEE transactions on components, packaging and manufacturing technology. Druck-Ausgabe New York, NY : IEEE, 2011DDC classification:

DOI: DOI: 10.1109/TCPMT.5503870Online resources:

Publication dates: Erscheinungsverlauf: 1.2011 -Holdings: Fachbibliothek HKA, IEEE Electronic Library (IEL) Fachhochschulkonsortium: 1.2011,1 -; KIT-Bibliothek, IEEE Electronic Library (IEL) Universitätskonsortium: 1.2011,1 -Continues: Vorg: Institute of Electrical and Electronics Engineers. IEEE transactions on advanced packaging., New York, NY : IEEE, 1999Continues: Vorg: Institute of Electrical and Electronics Engineers. IEEE transactions on components and packaging technologies., New York, NY : IEEE, 1999Continues: Vereinigung von: Institute of Electrical and Electronics Engineers. IEEE transactions on electronics packaging manufacturing., New York, NY : IEEE, 1999.PPN: PPN: 646618008ZDB ID: ZDB-ID: 2595289-4Package identifier: Produktsigel: ZDB-37-IEL

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