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LED packaging for lighting applications : design, manufacturing and testing / Sheng Liu; Xiaobing Luo

By: Contributor(s): Resource type: Ressourcentyp: Buch (Online)Book (Online)Language: English Publisher: Singapore : John Wiley & Sons (Asia), 2011Edition: Online-AusgDescription: Online-Ressource (1 online resource (xx, 352 p.)) : illISBN:
  • 9781283203579
  • 128320357X
  • 9780470827840
Subject(s): Additional physical formats: 9780470827833 | 0470827831 | 9780470827840 | 1283203456 | Druckausg.: 1283203456 | Erscheint auch als: LED packaging for lighting applications. Druck-Ausgabe Singapore : Wiley, 2011. XX, 352 S.DDC classification:
  • 621.381522
  • 621.3815/22 23
  • TEC008010
RVK: RVK: ZN 4192 | ZN 8985 | ZN 5040LOC classification:
  • TK7871.89.L53
Online resources: Summary: LED Packaging for Lighting Applications: Design, Manufacturing and Testing -- Contents -- Foreword By Magnus George Craford -- Foreword By C. P. Wong -- Foreword By B. J. Lee -- Preface -- Acknowledgments -- About the Authors -- 1 Introduction -- 1.1 Historical Evolution of Lighting Technology -- 1.2 Development of LEDs -- 1.3 Basic Physics of LEDs -- 1.3.1 Materials -- 1.3.2 Electrical and Optical Properties -- 1.3.3 Mechanical and Thermal Properties -- 1.4 Industrial Chain of LED -- 1.4.1 LED Upstream Industry -- 1.4.2 LED Midstream Industry -- 1.4.3 LED Downstream Industry -- 1.5 Summary -- References -- 2 Fundamentals and Development Trends of High Power LED Packaging -- 2.1 Brief Introduction to Electronic Packaging -- 2.1.1 About Electronic Packaging and Its Evolution -- 2.1.2 Wafer Level Packaging, More than Moore, and SiP -- 2.2 LED Chips -- 2.2.1 Current Spreading Efficiency -- 2.2.2 Internal Quantum Efficiency -- 2.2.3 High Light Extraction Efficiency -- 2.3 Types and Functions of LED Packaging -- 2.3.1 Low Power LED Packaging -- 2.3.2 High Power LED Packaging -- 2.4 Key Factors and System Design of High Power LED Packaging -- 2.5 Development Trends and Roadmap -- 2.5.1 Technology Needs -- 2.5.2 Packaging Types -- 2.6 Summary -- References -- 3 Optical Design of High Power LED Packaging Module -- 3.1 Properties of LED Light -- 3.1.1 Light Frequency and Wavelength -- 3.1.2 Spectral Distribution -- 3.1.3 Flux of Light -- 3.1.4 Lumen Efficiency -- 3.1.5 Luminous Intensity, Illuminance and Luminance -- 3.1.6 Color Temperature, Correlated Color Temperature and Color Rendering Index -- 3.1.7 White Light LED -- 3.2 Key Components and Packaging Processes for Optical Design -- 3.2.1 Chip Types and Bonding Process -- 3.2.2 Phosphor Materials and Phosphor Coating Processes -- 3.2.3 Lens and Molding Process -- 3.3 Light Extraction.PPN: PPN: 809371723Package identifier: Produktsigel: ZDB-26-MYL | ZDB-30-PAD | ZDB-30-PQE
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