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Lead-free solders : materials reliability for electronics / edited by K.N. Subramanian
Mitwirkende(r): Resource type: Ressourcentyp: Buch (Online)Buch (Online)Sprache: Englisch Reihen: Wiley series in materials for electronic and optoelectronic applications | Wiley Series in Materials for Electronic and Optoelectronic Applications Ser ; v.40Verlag: Chichester, West Sussex : Wiley, 2012Auflage: Online-AusgBeschreibung: Online-Ressource (1 online resource (xxi, 498 p.)) : illISBN:- 9781280590269
- 1280590262
- 9781119966210
- 9780470971826
- 621.381
- TK7836
- TK7836 .S825 2012
Inhalte:
Zusammenfassung: Providing a viable alternative to lead-based solders is a major research thrust for the electrical and electronics industries - whilst mechanically compliant lead-based solders have been widely used in the electronic interconnects, the risks to human health and to the environment are too great to allow continued widescale usage. Lead-free Solders: Materials Reliability for Electronics chronicles the search for reliable drop-in lead-free alternatives and covers: Phase diagrams and alloy development Effect of minor alloying additions Composite approaches including nanoscale reinforcements Mechanical issues affecting reliability Reliability under impact loading Thermomechanical fatigue Chemical issues affecting reliability Whisker growth Electromigration Thermomigration Presenting a comprehensive understanding of the current state of lead-free electronic interconnects research, this book approaches the ongoing research from fundamental, applied and manufacturing perspectives to provide a balanced view of the progress made and the requirements which still have to be met.Zusammenfassung: Lead-free Solders: Materials Reliability for Electronics -- Contents -- Series Preface -- Preface -- List of Contributors -- Thematic Area I: Introduction -- 1 Reliability of Lead-Free Electronic Solder Interconnects: Roles of Material and Service Parameters -- 1.1 Material Design for Reliable Lead-Free Electronic Solders Joints -- 1.2 Imposed Fields and the Solder Joint Responses that Affect Their Reliability -- 1.3 Mechanical Integrity -- 1.4 Thermomechanical Fatigue (TMF) -- 1.5 Whisker Growth -- 1.6 Electromigration (EM) -- 1.7 Thermomigration (TM) -- 1.8 Other Potential Issues -- Thematic Area II: Phase Diagrams and Alloying Concepts -- 2 Phase Diagrams and Their Applications in Pb-Free Soldering -- 2.1 Introduction -- 2.2 Phase Diagrams of Pb-Free Solder Systems -- 2.3 Example of Applications -- 2.3.1 General Applications (Melting, Solidification, Interfacial Reactions) -- 2.3.2 Effective Undercooling Reduction (Co Addition) -- 2.3.3 Unexpected Compound Formation (Sn-Ag/Cu Interfacial Reactions) -- 2.3.4 Unexpected Growth Rates (Sn-Bi/Fe and Sn-Pb/Fe) -- 2.3.5 Unexpected Melting of Solder (Sn-Sb/Ag) -- 2.3.6 Up-Hill Diffusion (Sn-Cu/Ni) -- 2.3.7 Limited Sn Supply (Au/Sn/Cu) -- 2.4 Conclusions -- Acknowledgments -- References -- 3 Phase Diagrams and Alloy Development -- 3.1 Introduction -- 3.2 Computational Thermodynamics as a Research Tool -- 3.2.1 Concept of the Calculation of Phase Diagrams for Multicomponent Systems -- 3.2.2 Modelling of the Gibbs Energy of the System -- 3.2.3 Critical Assessment of Thermodynamic Properties -- 3.3 Thermodynamic Databases - the Underlying Basis of the Modelling of Phase Diagrams and Thermodynamic Properties, Databases for Lead-Free Solders -- 3.3.1 Creation of the Thermodynamic Databases -- 3.3.2 Three Conditions of Consistency.PPN: PPN: 809668815Package identifier: Produktsigel: ZDB-26-MYL | ZDB-30-PAD | ZDB-30-PQE
Lead-free Solders: Materials Reliability for Electronics; Contents; Series Preface; Preface; List of Contributors; Thematic Area I: Introduction; 1 Reliability of Lead-Free Electronic Solder Interconnects: Roles of Material and Service Parameters; 1.1 Material Design for Reliable Lead-Free Electronic Solders Joints; 1.2 Imposed Fields and the Solder Joint Responses that Affect Their Reliability; 1.3 Mechanical Integrity; 1.4 Thermomechanical Fatigue (TMF); 1.5 Whisker Growth; 1.6 Electromigration (EM); 1.7 Thermomigration (TM); 1.8 Other Potential Issues
Thematic Area II: Phase Diagrams and Alloying Concepts2 Phase Diagrams and Their Applications in Pb-Free Soldering; 2.1 Introduction; 2.2 Phase Diagrams of Pb-Free Solder Systems; 2.3 Example of Applications; 2.3.1 General Applications (Melting, Solidification, Interfacial Reactions); 2.3.2 Effective Undercooling Reduction (Co Addition); 2.3.3 Unexpected Compound Formation (Sn-Ag/Cu Interfacial Reactions); 2.3.4 Unexpected Growth Rates (Sn-Bi/Fe and Sn-Pb/Fe); 2.3.5 Unexpected Melting of Solder (Sn-Sb/Ag); 2.3.6 Up-Hill Diffusion (Sn-Cu/Ni); 2.3.7 Limited Sn Supply (Au/Sn/Cu); 2.4 Conclusions
AcknowledgmentsReferences; 3 Phase Diagrams and Alloy Development; 3.1 Introduction; 3.2 Computational Thermodynamics as a Research Tool; 3.2.1 Concept of the Calculation of Phase Diagrams for Multicomponent Systems; 3.2.2 Modelling of the Gibbs Energy of the System; 3.2.3 Critical Assessment of Thermodynamic Properties; 3.3 Thermodynamic Databases - the Underlying Basis of the Modelling of Phase Diagrams and Thermodynamic Properties, Databases for Lead-Free Solders; 3.3.1 Creation of the Thermodynamic Databases; 3.3.2 Three Conditions of Consistency
3.3.3 Specialized Databases for the Modelling of Thermodynamic Properties of Systems Relevant for Lead-Free Solders3.4 Application of the SOLDERS Database to Alloy Development; 3.4.1 Modelling of Phase Diagrams and Thermodynamic Properties; 3.4.2 Modelling of Other Properties; 3.5 Conclusions; References; 4 Interaction of Sn-based Solders with Ni(P) Substrates: Phase Equilibria and Thermochemistry; 4.1 Introduction; 4.2 Binary Phase Equilibria; 4.2.1 Literature Overview; 4.2.2 New Experimental Results; 4.3 Ternary Phase Equilibria Ni-P-Sn; 4.3.1 Literature Overview; 4.3.2 Experimental Results
4.4 Thermochemical Data4.4.1 Literature Overview; 4.4.2 New Experimental Results; 4.5 Relevance of the Results and Conclusion; Acknowledgments; References; Thematic Area III: Microalloying to Improve Reliability; 5 'Effects of Minor Alloying Additions on the Properties and Reliability of Pb-Free Solders and Joints'; 5.1 Introduction; 5.2 Controlling Ag?Sn Plate Formation; 5.3 Controlling the Undercooling of Sn Solidification; 5.4 Controlling Interfacial Reactions; 5.4.1 Dissolution of UBM and Surface Finishes; 5.4.2 Cu-Sn Intermetallic Formation; 5.4.3 Interfacial Void Formation
5.4.4 Spalling of Ni-Sn Intermetallics
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