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Thermal management of microelectronic equipment : heat transfer theory, analysis methods and design practices / L.T. Yeh, R.C. Chu

By: Contributor(s): Resource type: Ressourcentyp: Buch (Online)Book (Online)Publisher number: 801683Language: English Series: ASME Press book series on electronic packagingPublisher: New York, N.Y. (ASME, Three Park Avenue. New York, NY 10016) : American Society of Mechanical Engineers, 2002Description: Online-Ressource (1 electronic text (xxi, 414 p.)) : ill., digital fileISBN:
  • 0791801683
Subject(s): Additional physical formats: 0791801683. | 0791801683 | Erscheint auch als: No title Druck-AusgabeDDC classification:
  • 621.381/04 21
LOC classification:
  • TK7870.25
DOI: DOI: 10.1115/1.801683Online resources: Additional physical formats: Also available in print.
Contents:
Summary: With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor in the design of electronic packaging, from chip to system levels. This book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologiesPPN: PPN: 816859175Package identifier: Produktsigel: ZDB-240-ASM
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Mode of access: World Wide Web.

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