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Photonic wire bonding as a novel technology for photonic chip interfaces / by Nicole Lindenmann

By: Contributor(s): Resource type: Ressourcentyp: Buch (Online)Book (Online)Language: English Series: Karlsruhe series in photonics & communications ; vol. 21Publisher: Karlsruhe : KIT Scientific Publishing, [2018]Description: 1 Online-Ressource (xxi, 222 Seiten) : IllustrationenISBN:
  • 9783731507468
Subject(s): Genre/Form: Additional physical formats: Erscheint auch als: Photonic wire bonding as a novel technology for photonic chip interfaces. Druck-Ausgabe Karlsruhe : KIT Scientific Publishing, 2018. xxi, 222 Seiten | Erscheint auch als: Photonic Wire Bonding as a Novel Technology for Photonic Chip Interfaces. Druck-Ausgabe. Karlsruhe, Baden : KIT Scientific Publishing, 2018. 256 Seiten, graph. DarstDDC classification:
  • 621.3
DOI: DOI: 10.5445/KSP/1000077963Online resources: Dissertation note: Dissertation - Karlsruhe, Karlsruher Institut für Technologie (KIT), 2018 PPN: PPN: 1015904076Package identifier: Produktsigel: GBV-ODiss
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