Uncooled thermal imaging : arrays, systems, and applications / Paul W. Kruse

Von:

Kruse, Paul W [aut]

Mitwirkende(r):

Resource type: Ressourcentyp: Buch (Online)Buch (Online)Sprache: Englisch Reihen: Tutorial texts in optical engineering ; 51Verlag: Bellingham, Wash. <1000 20th St. Bellingham WA 98225-6705 USA> : SPIE, c2001Beschreibung: 1 online resource (xviii, 89 p. : ill.)ISBN:

9780819480484
0819442118
9780819441225

Schlagwörter:

Andere physische Formen: 9780819441225. | 0819442118. | Available in another form: Kein Titel DDC-Klassifikation:

621.362
621.36/2 21

LOC-Klassifikation:

TA1570

DOI: DOI: 10.1117/3.415351Online-Ressourcen:

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Andere physische Formen: Also available in print version.Zusammenfassung: This introduction to uncooled infrared focal plane arrays and their applications is aimed at professionals, students, and end users. Topics include principal uncooled thermal detection mechanisms; fundamental performance limits and theoretical performance; the state of the art; and applications, technical trends, and systems employing uncooled arraysZusammenfassung: Chapter 2. Fundamental limits -- 2.1. Introduction -- 2.2. Photon noise limitations of thermal detectors -- 2.3. Temperature fluctuation noise in thermal detectors -- 2.4. Temperature fluctuation noise limit to focal plane array performance -- 2.5. Background fluctuation noise limit to focal plane array performance -- 2.6. Discussion -- ReferencesZusammenfassung: Chapter 3. Thermoelectric arrays -- 3.1. Introduction -- 3.2. The heat flow equation -- 3.3. Responsivity -- 3.4. Noise -- 3.5. D* -- 3.6. Noise equivalent temperature difference -- 3.7. Pixel design optimization -- ReferencesZusammenfassung: Chapter 4. Resistive bolometers -- 4.1. Introduction -- 4.2. Responsivity. 4.2.1. Case I: No Joulean heating; constant bias; 4.2.2. Case II: Joulean heating; constant bias; 4.2.3. Case III: Joulean heating; pulsed bias -- 4.3. Noise -- 4.4. Noise equivalent temperature difference -- 4.5. Choice of resistive materials. 4.5.1. Vanadium oxide; 4.5.2. Amorphous silicon; 4.5.3. Thermistor materials; 4.5.4. Titanium; 4.5.5. P-N junction diodes -- ReferencesZusammenfassung: Chapter 5. Pyroelectric arrays -- 5.1. Introduction -- 5.2. The heat flow equation -- 5.3. Responsivity -- 5.4. Johnson noise -- 5.5. Temperature fluctuation noise -- 5.6. Noise equivalent temperature difference -- ReferencesZusammenfassung: Chapter 6. State of the art and technical trends -- 6.1. Introduction -- 6.2. Resistive bolometer arrays and their applications in thermal imagers and imaging radiometers. 6.2.1. The Honeywell silicon microstructure resistive bolometer array and thermal imager; 6.2.2. Improvements on the Honeywell VOx 240 x 332 pixel bolometer array; 6.2.3. Use of amorphous silicon rather than vanadium oxide as the resistive material; 6.2.4. Use of diodes rather than resistive materials; 6.2.5. Thermal imagers employing uncooled VOx bolometer Arrays; 6.2.6. Imaging radiometers based on 320 x 240 pixel uncooled VOx Bolometers; 6.2.7. Summary -- 6.3. Pyroelectric and ferroelectric bolometer uncooled arrays and thermal imagers that employ them. 6.3.1. Introduction; 6.3.2. The Texas Instruments (now Raytheon) hybrid ferroelectric bolometer array and imagers; 6.3.3. Monolithic pyroelectric array development -- 6.4. Uncooled thermoelectric arrays and thermal imagers and imaging radiometers that employ them. 6.4.1. Introduction; 6.4.2. Monolithic linear arrays; 6.4.3. Imaging radiometer employing linear thermoelectric arrays -- 6.5. Status and trends of uncooled arrays. 6.5.1. Status and trends of uncooled arrays for military systems; 6.5.2. Status and trends of commercial uncooled arrays and systems -- ReferencesZusammenfassung: Chapter 7. Choosing the proper technical approach for a given application -- 7.1. Introduction -- 7.2. Thermal imaging applications -- 7.3. Comparison of the principal types of uncooled thermal detectors -- IndexZusammenfassung: List of figures -- List of tables -- Preface -- Chapter 1. An overview of uncooled thermal imaging detection mechanisms and their figures of merit -- 1.1. Terminology -- 1.2. Detection mechanisms. 1.2.1. Photon detection mechanisms; 1.2.2. Thermal detection mechanisms; 1.2.3. Wave interaction effects -- 1.3. Figures of merit. 1.3.1. Responsivity; 1.3.2. Noise equivalent power and D*; 1.3.3. Noise equivalent temperature difference; 1.3.4. Minimum resolvable temperature difference; 1.3.5. Thermal response time -- ReferencesPPN: PPN: 1018189785Package identifier: Produktsigel: ZDB-50-SPI

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