Materials science and technology of optical fabrication / Tayyab I. Suratwala

Von:

Suratwala, Tayyab [VerfasserIn]

Resource type: Ressourcentyp: Buch (Online)Buch (Online)Sprache: Englisch Verlag: Hoboken, NJ, USA : John Wiley and Sons, Inc, 2018Beschreibung: 1 Online-RessourceISBN:

9781119423744

Schlagwörter:

Andere physische Formen: 9781119423683 | 1119423740. | Erscheint auch als: Materials science and technology of optical fabrication. Druck-Ausgabe Hoboken, NJ : Wiley, 2018. xxx, 379 SeitenDDC-Klassifikation:

681.4

LOC-Klassifikation:

TS513

Online-Ressourcen:

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Zusammenfassung: 2.5.4 Moment Forces2.5.5 Viscoelastic and Viscoplastic Lap Properties; 2.5.5.1 Viscoelastic Lap; 2.5.5.2 Viscoplastic Lap; 2.5.6 Workpiece-Lap Mismatch; 2.5.6.1 Workpiece Shape; 2.5.6.2 Pad Wear/Deformation; 2.5.6.3 Workpiece Bending; 2.5.6.4 Residual Grinding Stress; 2.5.6.5 Temperature; 2.5.6.6 Global Pad Properties; 2.5.6.7 Slurry Spatial Distribution; 2.5.6.8 Local Nonlinear Material Deposits; 2.6 Deterministic Surface Figure; References; Chapter 3 Surface Quality; 3.1 Subsurface Mechanical Damage; 3.1.1 Indentation Fracture Mechanics; 3.1.1.1 Static IndentationZusammenfassung: 3.1.1.2 Edge Chipping and Bevels3.1.1.3 Sliding Indentation; 3.1.1.4 Impact Indentation Fracture; 3.1.2 SSD During Grinding; 3.1.2.1 Subsurface Mechanical Depth Distributions; 3.1.2.2 Relationship of Roughness and Average Crack Length to the Maximum SSD Depth; 3.1.2.3 Fraction of Abrasive Particles Mechanically Loaded; 3.1.2.4 Relationship Between the Crack Length and Depth; 3.1.2.5 SSD Depth‐distribution Shape; 3.1.2.6 Effect of Various Grinding Parameters on SSD Depth Distributions; 3.1.2.7 Rogue Particles During Grinding; 3.1.2.8 Conclusions on Grinding SSD; 3.1.3 SSD During PolishingZusammenfassung: 3.1.4 Effect of Etching on SSD3.1.4.1 Topographical Changes of SSD During Etching; 3.1.4.2 Influence of SDD Distribution on Etch Rate and Roughness; 3.1.5 Strategies to Minimize SSD; 3.2 Debris Particles and Residue; 3.2.1 Particles; 3.2.2 Residue; 3.2.3 Cleaning Strategies and Methods; 3.3 The Beilby Layer; 3.3.1 K Penetration by Two‐step Diffusion; 3.3.2 Ce Penetration by Chemical Reactivity; 3.3.3 Chemical-Structural-Mechanical Model of the Beilby Layer and Polishing Process; References; Chapter 4 Surface Roughness; 4.1 Single‐Particle Removal Function; 4.2 Beilby Layer PropertiesZusammenfassung: 4.3 Slurry PSD4.4 Pad Mechanical Properties and Topography; 4.5 Slurry Interface Interactions; 4.5.1 Slurry Islands and ‐roughness; 4.5.2 Colloidal Stability of Particles in Slurry; 4.5.3 Glass Reaction Product Buildup at Polishing Interface; 4.5.4 Three‐Body Forces at Polishing Interface; 4.6 Slurry Redeposition; 4.7 Predicting Roughness; 4.7.1 EHMG - The Ensemble Hertzian Multi‐gap Model; 4.7.1.1 Pad Deflection and Fraction of Pad Area Making Contact; 4.7.1.2 Asperity Stress, Interface Gap, Load/Particle Distribution, and Fraction of Active ParticlesZusammenfassung: Cover; Title Page; Copyright; Contents; Preface; Acknowledgments; Glossary of Symbols and Abbreviations; Part I Fundamental Interactions - Materials Science; Chapter 1 Introduction; 1.1 Optical‐Fabrication Processes; 1.2 Major Characteristics of the Optical‐Fabrication Process; 1.3 Material Removal Mechanisms; References; Chapter 2 Surface Figure; 2.1 The Preston Equation; 2.2 The Preston Coefficient; 2.3 Friction at Interface; 2.4 Kinematics and Relative Velocity; 2.5 Pressure Distribution; 2.5.1 Applied Pressure Distribution; 2.5.2 Elastic Lap Response; 2.5.3 Hydrodynamic ForcesPPN: PPN: 1030216142Package identifier: Produktsigel: ZDB-4-NLEBK

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