Nanofabrication : principles to laboratory practice / Andrew Sarangan (University of Dayton, OH, USA)

Von:

Sarangan, Andrew [VerfasserIn]

Resource type: Ressourcentyp: Buch (Online)Buch (Online)Sprache: Englisch Reihen: Optical Sciences and Applications of Light SerVerlag: Boca Raton ; London ; New York : CRC Press, [2017]Beschreibung: 1 Online-Ressource (316 p)ISBN:

1498725597
9781498725590

Schlagwörter:

Andere physische Formen: 9781498725576. | Erscheint auch als: Nanofabrication. Druck-Ausgabe Boca Raton : CRC Press, Taylor & Francis Group, 2017. xv, 299 SeitenDDC-Klassifikation:

621.381531

RVK: RVK: VE 9850LOC-Klassifikation:

TK7874.843.S27 2017

Online-Ressourcen:

Zugang im Netz des KIT

Zusammenfassung: 1.1.10 Nanofabrication Is a Multidisciplinary Science1.1.11 Units of Measure; 1.2 Cleanrooms for Device Fabrication: Basic Concepts; 1.2.1 Cleanroom Classification and Airflow Rates; 1.2.2 Particle Count Measurement; 1.2.3 Service Access; 1.2.4 Humidity, Temperature, and Lighting; 1.2.5 Safety; Problems; Laboratory Exercise; References; Chapter 2: Fundamentals of Vacuum and Plasma Technology; 2.1 Fundamentals of Vacuum; 2.1.1 Conductance; 2.1.2 Pumping; 2.1.3 Effect of a Vacuum House; 2.1.4 Rough Vacuum; 2.1.5 High-Vacuum Pumps; 2.1.5.1 Turbo Molecular Pumps; 2.1.5.2 Cryo Pumps; 2.1.6 LeaksZusammenfassung: 2.1.7 Adsorption and Desorption2.1.8 Types of Pumps; 2.2 Pressure and Flow Measurement; 2.2.1 Pressure (or Vacuum) Measurement; 2.2.2 Gas Flow Rate Measurement; 2.3 Fundamentals of Plasmas for Device Fabrication; 2.3.1 Parallel Plate Configuration; 2.3.2 Electron and Bulk Gas Temperature; 2.3.3 Langmuir's Probe; 2.3.4 DC Ion Sputtering and Implantation; 2.3.5 RF Plasma; 2.3.6 Other Electrical Plasma; Problems; Laboratory Exercises; References; Chapter 3: Physical and Chemical Vapor Deposition; 3.1 Physical Vapor Deposition; 3.1.1 Thermal Evaporation; 3.1.1.1 Resistance Heating MethodZusammenfassung: 3.1.1.2 Electron Beam Evaporation3.1.1.3 Thermal Evaporation Rate from the Source; 3.1.1.4 Deposition Rate and Distribution; 3.1.1.5 E-Beam Evaporation of Dielectrics; 3.1.1.6 Reactive Thermal Evaporation; 3.1.1.7 Thermal Evaporation of Alloys and Compounds; 3.1.1.8 Ion-Assisted Deposition; 3.1.2 Sputter Removal and Deposition Down; 3.1.2.1 Sputter Removal mechanism; 3.1.2.2 Sputter Yield; 3.1.2.3 Magnetron Sputtering; 3.1.2.4 Sputter Removal Rate; 3.1.2.5 Sputter Deposition Rate; 3.1.2.6 Dependence of Sputter Deposition Rate on Pressure; 3.1.2.7 Energy of the Sputtered AtomsZusammenfassung: 3.1.2.8 Sputter Up versus Sputter Down3.1.2.9 Compound Sputtering; 3.1.2.10 Co-Sputtering; 3.1.2.11 Reactive Sputtering; 3.1.2.12 Thermal Evaporation versus Sputtering; 3.1.3 Pulsed Laser Deposition; 3.2 Chemical Vapor Deposition; 3.2.1 Atmospheric Pressure Chemical Vapor Deposition; 3.2.2 Low-Pressure Chemical Vapor Deposition; 3.2.3 Plasma-Enhanced Chemical Vapor Deposition; 3.2.4 Atomic Layer Deposition; 3.3 Thin-Film Measurements; 3.3.1 Thickness Measurement with a Quartz Crystal Microbalance; 3.3.1.1 Temperature Sensitivity; 3.3.1.2 Tooling Factor; 3.3.1.3 Film StressZusammenfassung: Cover; Half Title; Title Page; Copyright Page; Table of Contents; Series Preface; Preface; Author; Chapter 1: Introduction to Micro- and Nanofabrication; 1.1 Introduction to Micro- and Nanofabrication; 1.1.1 Importance of Understanding the Techniques; 1.1.2 Creative Problem Solving; 1.1.3 What Has Been Done by Others versus What You Can Do; 1.1.4 Experiment versus Project; 1.1.5 Nano and the Media; 1.1.6 Carbon versus Silicon and Self-Assembly versus Micromachining; 1.1.7 Nanotechnology Is Old; 1.1.8 Moore's Prediction and Driving Forces; 1.1.9 Why Components Have to Be SmallPPN: PPN: 1040005438Package identifier: Produktsigel: ZDB-4-NLEBK

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