Custom cover image
Custom cover image

Reliability Physics and Engineering : time-to-failure modeling / J.W. McPherson

By: Resource type: Ressourcentyp: Buch (Online)Book (Online)Language: English Series: SpringerLink Bücher | Springer eBook CollectionPublisher: Cham : Springer, 2019Edition: Third editionDescription: Online-Ressource (XVII, 463 p. 207 illus., 164 illus. in color, online resource)ISBN:
  • 9783319936833
Subject(s): Additional physical formats: 9783319936826 | 9783319936840 | Erscheint auch als: 978-3-319-93682-6 Druck-AusgabeDDC classification:
  • 621.3815
RVK: RVK: ZG 9270LOC classification:
  • TK7888.4
DOI: DOI: 10.1007/978-3-319-93683-3Online resources: Summary: This third edition textbook provides the basics of reliability physics and engineering that are needed by electrical engineers, mechanical engineers, civil engineers, biomedical engineers, materials scientists, and applied physicists to help them to build better devices/products. The information contained within should help all fields of engineering to develop better methodologies for: more reliable product designs, more reliable materials selections, and more reliable manufacturing processes- all of which should help to improve product reliability. A mathematics level through differential equations is needed. Also, a familiarity with the use of excel spreadsheets is assumed. Any needed statistical training and tools are contained within the text. While device failure is a statistical process (thus making statistics important), the emphasis of this book is clearly on the physics of failure and developing the reliability engineering tools required for product improvements during device-design and device-fabrication phases. Provides a comprehensive textbook on reliability physics of semiconductors, from fundamentals to applications; Explains the fundamentals of reliability physics and engineering tools for building better products; Contains statistical training and tools within the text; Includes new chapters on Physics of Degradation, and Resonance and Resonance-Induced DegradationSummary: Introduction -- Physics of Degradation -- Time Dependence of Materials and Device Degradation -- From Material/Device Degradation to Time-To-Failure -- Time-To-Failure Modeling -- Gaussian Statistics - An Overview -- Time-To-Failure Statistics -- Failure Rate Modeling -- Accelerated Degradation -- Acceleration Factor Modeling -- Ramp-To-Failure Testing -- Time-To-Failure Models for Selected Failure Mechanisms in Integrated Circuits -- Time-To-Failure Models for Selected Failure Mechanisms in Mechanical Engineering -- Conversion of Dynamical Stresses Into Effective Static Values -- Resonance and Resonance-Induced Degradation -- Increasing the Reliability of Device/Product Designs -- Screening -- Heat Generation and Dissipation -- Sampling Plans and Confidence Intervals --PPN: PPN: 1045549789Package identifier: Produktsigel: ZDB-2-ENG | ZDB-2-SEB | ZDB-2-SXE
No physical items for this record

Reproduktion. (Springer eBook Collection. Engineering)

KIT – The Research University in the Helmholtz Association                         Home | Impressum | Datenschutz | Barrierefreiheit | KIT